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Course Description This course provides an overview of RTP through the topics of equipment, technology, and processing. A discussion of the architecture and spectral features of RTP hardware will include a survey of currently available RTP equipment. The process spectrum of RTP is presented, which includes specific device applications for both stand-alone as well as cluster-tool systems. In addition, characterization of RTP processes, such as implanted and annealed wafers as well as various thin films (oxide, nitride, and titanium nitride), are discussed. This course introduces the novice to the rapid thermal processor: what it is, how it works, how it is utilized in the wafer fab, and how to characterize several of its processes. Fundamentals of the RTP equipment (lamp heating, system architecture, temperature measurement), technology (terminology, temperature profiles, pulse duration, and applications) and the rapid thermally processed wafer (device applications and process characterization) are discussed. Process uniformity is discussed in conjunction with currently available equipment used to make a full wafer evaluation of various rapid thermal processes. Results from several round robin evaluations will be included. Wafer contour maps will then be used to instruct the student in the basics of solving various RTP equipment and process problems. Course Objectives
Who Should Attend? Technicians, engineers, and other personnel who wish to acquire a general introduction to rapid thermal processing (RTP) from the aspects of equipment, technology, and process. Course Length: 1 day Course Materials: Course Notes Instructor: Chuck Yarling Course Outline
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