ION 101: The Vocabulary of Ion Implantation Equipment and Operations

Course Description

A major contributor to inefficiency and/or errors in the day-to-day operation of ion implanters is a lack of general understanding of the basic underlying concepts and cause-and-effect relationships associated with this most difficult wafer process. This course focuses on the entire implant production process, from plasma generation (source) to ion transport (scanning, vacuum) to ion measurement (dosimetry). This course introduces the common language of ion implantation as used in today’s modern wafer fab. Graphics, illustrations, and quizzes are utilized to provide a stimulating and productive learning environment.

Course Objectives

Develop a common language to facilitate communication amongst diversely experienced personnel

Provide a foundation for further training in other related fields (RTP, Process Control, Metrology, etc.)

Learn about how an ion implanter really works

Understand critical cause and effects that jeopardize accurate implantation

Develop skills to reduce errors and improve productivity

Who Should Attend?

This course is designed for operators, supervisors, new process and equipment technicians, and all other personnel who desire a common language that is useful in understanding the fundamentals of ion implantation equipment and the implant process.

Course Length: 2 days

Course Materials: Course Notes; The Implant Glossary, by C. B. Yarling, Ion Beam Press (1997)

Instructor: Craig Heden

Course Outline

The Human Component - The 3 A’s

- Attitude
- Awareness
- Alertness

Process Interdependency in Ion Implant
Hazards and Safety
Atomic Theory
Ionization
Extraction
Vacuum
Analysis
Acceleration
Focus (optics)
Scanning
Dose Monitoring
Contamination
Electron Flood / Shower

email C B Yarling
Phone/Fax: 512.292.9189

Home | Ion Beam Press | EEESPEC
Semiconductor Technology Institute | Site Map