STI | Courses | Faculty
This course covers two widely used techniques for the deposition of thin films: physical-vapor deposition and chemical-vapor deposition with emphasis on the strengths and limitations of each method.
First, the basics of the vacuum and plasma environments are introduced including various methods of producing a plasma. Next, the physical processes of evaporation and sputtering are discussed along with reactive and ion-enhanced modifications of these techniques. Methods for in-situ monitoring and control are surveyed.
The third part of the course covers chemical vapor deposition, both thermal from atmospheric pressure to low pressure with an ultra-high vacuum background and low-pressure plasma-enhanced processes employing glow-discharge or high-density ion sources.
The last part of the course will discuss the growth, structure and the sources of stress in thin films.
If time allows, the common methods for measuring film properties such as thickness, optical properties resistivity, stress, hardness, adhesion will be discussed.
Who Should Attend?
Process, equipment and device engineers; process and equipment technicians without a thin-film technology background who must decide what deposition process best suits their needs and those who wish to broaden their perspective on thin-film PVD and CVD technology.
Course Length: 1 day
Course Materials: Course Notes
Instructor: Robert Waits
Structure zone model for thick films
CVD of metals